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Product Guide
Ceramic Flip Chip
LGA, BGA, PGA Chip Scale Packages
Ceramic PGA
Cavity Down PGA
Cavity Up PGA
Surface Mount PGA
Fiber Optic Device Packages
Butterfly Package (BTF)
Min-Dil Package
Optical Feed-thru Package
Optical PGA
Side Braze / Dip Package
Tosa/Rosa
Leaded Chip Carrier
Bottom Brazed Package
Ceramic Quad Flat Pack (CQFP)
Fine Pitch Leaded Chip Carrier
J Leaded Chip Carrier
Top Brazed Package
Leadless Chip Carrier
CIS CMOS Image Sensor Package
Crystal/SAW Package
LCC
Surface Mount Device (SMD)
Low Temperature Co-fired Ceramic (LTCC)
L-C-R Integration
LTCC Substrate
Surface Mount Device (SMD)
Micro-electrical Mechanical System (MEMS)
MEMS Package
Multi-chip Ceramic Module (MCM)
Motherboard Package
Multi-Chip Ceramic Module
System-in-a-Package (SiP)/MCM
Top Brazed Package
Probe Card Interface (STF)
Ceramic Probecard Interface
RF Power/Transistor Packages
Diode Package
Hybrid Power Package
Micro X Package
Microwave Package
Millimeter Wave Package
MMIC Device Package
RF Power Package
Side Braze/DIP Packages
Charged Coupled Device Package – CCD
Hybrid Package
Image Sensor Package
Side Braze / Dip Package
Thin Film
Multi Chip Thin Film on Ceramic
Thin Film Submounts
Optical PGA
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Application
Material
Features
Applications Notes
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