Side Braze / Dip Package
Dual in-line packages with conventional thru-hole and J-bend lead configurations. NTK also makes a wide variety of bucket style packages that are suitable for hybrid IC and custom MCM packages.
HTCC material is available. See design guide on Applications Note Section for more details.
• Products can be ordered individually or in lots as needed.
We also offer optimal designs and standard products to support a wide range of applications.
• Hermetically encapsulated packages offering enhanced thermal dissipation
.• Wide range of pin counts.
• EIAJ or JEDEC configurations