Cavity Down PGA
This package is one of the most common for Server, MPU and high performance ASIC designs. Micropin, (SMT), interstitial, and standard thru-hole matrix styles are available.
HTCC materials are available. Please refer to the material properties of the table with respect to material properties.
Micropin, (SMT), interstitial, and standard thru-hole matrix styles are available. Heat sink or heat spreader options are possible for high power dissipation devices. Available for Wire Bond or Flip Chip die attach.
• EIAJ or JEDEC configurations
Products can be ordered individually or in lots as needed.
We also offer optimal designs and standard products to customer needs.