System-in-a-Package (SiP)/MCM

Application
Hi performance high reliability applications require variety of advanced technologies. NTK's MCM substrates incorporate a mix of technologies in order to meet the demands of high integration, high-speed data processing, and low.

Material
HTCC materials are available. Please refer to the material properties of the table with respect to material properties.

Products can be ordered individually or in lots as needed.
Custom designs and standard products are supported.

Features
• Multilayer Ceramic Package
• Two or four side, Top Brazed option
• Excellent electrical performance and thermal management
• Surface Mount or Socket Applications
• Gold Plated Leads
• Solder, Glass or Epoxy Seal ???