Product Guide

  • Gyrosensor

Side Braze / Dip Package

c dip component Contact NTK

Application
Dual in-line packages with conventional thru-hole and J-bend lead configurations. NTK also makes a wide variety of bucket style packages that are suitable for hybrid IC and custom MCM packages.

Material
HTCC material is available. See design guide on Applications Note Section for more details.

Features
• Products can be ordered individually or in lots as needed.
We also offer optimal designs and standard products to support a wide range of applications.
• Hermetically encapsulated packages offering enhanced thermal dissipation
.• Wide range of pin counts.
• EIAJ or JEDEC configurations

Applications Notes