Diode Package

Application
Packages are specifically designed for high speed fiber optic applications.

Material
These packages feature Ceramic-to-metal feed-thru leads for optimal function and reliability. Metal body with standard or custom heat sink material.

Features
• Excellent electrical performance in a wide range of package sizes
• Small through hole mounting package with rugged construction
• High I/O signal carrying capacity
• Hermetically encapsulated packages offering enhanced thermal dissipation• Ceramic-to-metal feed-thru with precise ceramic dimension and brazing