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Micro X Package

Application
Micro-T packages are leaded multilayer ceramic packages specially designed to handle high frequency microwave diodes.

Material
These packages feature Ceramic-to-metal feed-thru leads for optimal function and reliability. Metal body with standard or custom heat sink material. Laser feed-thru with ball lens, glass or sapphire window.

Features
• A hermetic packaging solution
• An approved military package for microwave diodes
• Either solder or epoxy seal
• Miniaturized package sizes, .070" or .100" square

Applications Notes