LCC

Application
LCC Packages offer thermal performance in high heat dissipation applications. The package is able to expand and contract during heating and cooling cycles minimizing undue stress on the package to PCB connection.

Material
Both HTCC and LTCC materials are available. Please refer to the material properties of the table with respect to material properties.

Features
• Multilayer Ceramic Package
• Two or four side, Top Brazed option
• Excellent electrical performance and thermal management
• Footprint Compatible with J Leaded and PLCC
• Surface Mount or Socket Applications
• Gold Plated Leads
• Solder, Glass or Epoxy Seal ???