J Leaded Chip Carrier

Application
The J Leaded Chip Carrier (CQFJ) provides thermal performance in high heat dissipation applications.

Material
The package meets exceptional planarity with a low co-efficient of thermal expansion. The J package is expand and contract during heating and cooling cycles minimizing undue stress on the package to PCB connection.

Features
• Multilayer Ceramic Package
• Two or four sided brazed
• Excellent electrical performance and thermal management
• Footprint compatible with LCC and PLCC
• Surface Mount or Socket Applications
• Gold Plated Leads
• Solder, Glass or Epoxy Seal