Product Introductions from NTK Technologies:NTK Technology Roadmap
We are developing technology that will allow us to produce organic packages with finer PTH size, smaller via diameters, and shrinking through hole pitch. Essentially, NTK is working everyday to meet the demands of the market that call for smaller, faster design. See our Technology Roadmap for more details.
Organic Flip Chip featuring NTS Technology
NTK has developed an organic buildup substrate technology for high-speed flip chip devices, called NTS. NTS is optimized for high density MPU and ASIC applications, where lower conductor resistance and low dielectric constant are required. Multiple buildup layers are possible around the BT core material. BGA or PGA styles are available.