 |
NTK offers a wide variety of "bath tub" packages for motherboard package applications. NTK's multilayer technology offers design flexibility for the integration of IC and passive components. |
 |
NTK offers various packages for MCM/SIP applications, ranging from several die to high density multiple die with or without individual cavities. |
||||
 |
NTK offers a variety of packages ideal for System-in-Pacakge (SIP) applications that range from several die to high density multiple die with or without individual cavities. |
 |
 |
 |
|
