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LTCC and HTCC ceramic substrates with built-in passive components. |
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Low Temperature Co-fired Ceramic packages that are ideal for the burgeoning high-speed wireless data communications market. Embedded or surface printed passives with low reistance conductors are possible in multi-layer or mono-layer structures. Flip chip or cavity designs are possible. Thermal vias may be designed to help maintain proper device operation temperature range. |
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Wide assortment of single chip and module package options for lighter weight and smaller packages. NTK LTCC technology in fine miniaturaztion provides ideal solution for mobile handset applications. |
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