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The Ceramic Quad Flat Package or leaded chip carrier is used for higher density and increased reliability with brazed leads for surface mount applications. The CQFP leads can be tied together for testing with non-conductive tie bar brazed leads. CQFPs are used in a variety of ASIC applications. |
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Fine Pitch Leaded Chip Carrier Mature and reliable technology for medium to high density devices. Fine Pitch Leaded Chip Carriers typically have top brazed or bottom brazed leads that are ideal for higher density surface mounting applications that require increased joint reliability. |
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J-Leaded Chip Carriers typically have top-brazed J-leads that are ideal for surface mounting applications that require increased joint reliability. They are also commonly used for prototyping and can also be inserted into sockets for field replacement applications. |
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