Ceramic Pin Grid Array (CPGA)

One of the most popular packages for MPU and high performance ASIC designs. Micropin (SMT), internstitial, and standard thru-hole matrix styles are available. Heat sink or heat spreader options are possible for high power dissipation devices. Available for Wire Bond or Flip Chip die attach.

F/C Pin Grid Array (PGA)

One of the most popular packages for MPU and high performance ASIC designs. Micropin (SMT), internstitial, and standard thru-hole matrix styles are available. Heat sink or heat spreader options are possible for high power dissipation devices. Available for Wire Bond or Flip Chip die attach.

Surface Mountable PGA

NTK Ceramic PGA packages with surface mount technology.