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Ideal for high frequency and high-density circuits. Allows for multiple build up layers with dielectric applied to the surface layer. Embedded passives (L and R) are possible within the thin film layer structure. |
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Multi-chip Thin Film on Ceramic Mono-layer Substrates NTK Thin Film technology with mono-layer alumina substrates as base material. |
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Multi-chip Thin Film on Ceramic Multilayer Substrates |
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Thin film material technology can be applied for high frequency and high-density circuits. Base materials can be co-fired multi-layer or mono-layer alumina substrates. Multiple build up layers are possible with Copper Polyimide (CuPi) dielectric applied to the surface layer. Embedded passives (L and R) are possible within the thin film layer structure. |
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