Semiconductor Components Division

Side Braze/DIP Packages

  

Charged Coupled Device Package (CCD)

Charged Coupled Device Packages are available in various designs including DIP, PGA, and LCC.


        

Hybrid Package

NTK offers a wide variety of "bath tub" packages for hybrid and custom multi-chip (MCM) applications. NTK's multilayer technology offers design flexibility for the integration of IC and passive components.


  

Image Sensor Package

Side braze and CCD packages especially designed for image sensor applications. Custom designed to meet specific customer requirements.


        

Side Braze Package

Dual in-line packages with conventional through hole and J-bend lead configurations. NTK also makes a wide variety of gbucket styleh packages that are suitable for hybrid IC and custom MCM packages.