Ball Grid Array

NTK offers Land Grid Array (LGA) packages ready for solder ball assembly. Flexible design rules for high speed and high-density requirements.

Bottom Brazed Package

NTK Flip Chip technology with bottom-brazed leads.

Chip Scale Package

NTK Chip Scale Package (CSP) incorporates all the design and technical aspects of our flip chip packages into precisely sized wafer level package.

F/C Pin Grid Array (PGA)

One of the most popular packages for MPU and high performance ASIC designs. Micropin (SMT), internstitial, and standard thru-hole matrix styles are available. Heat sink or heat spreader options are possible for high power dissipation devices. Available for Wire Bond or Flip Chip die attach.

Land Grid Array

Flexible design rules for high speed and high-density requirements. NTK's high volume manufacturing and excellent quality make this type very cost effective.

Top Brazed Package

NTK Flip Chip technology with top-brazed leads.