Ceramic Flip Chip

F/C Pin Grid Array (PGA)

General Information

Alumina Cofired Ceramic Flip Chip Package - General Design Guide (PDF)

Heat Spreader

Ceramic Package General Outline

Ceramic Material Characteristics

Ceramic F/C Dimensional Specifications

Ceramic F/C Package Outline

Ceramic F/C Area

Ceramic F/C Fine Design Rules Area

HTCC Package General Design Guide (PDF)

Kovar Seal Ring

About NTK Part Numbering for Semiconductor Packages

Ceramic Pin Grid Array Open Tools List

General Open Tools List

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Contact Semiconductor Components Division
  

Features:

  • High-density package style for ASIC and MPU devices
  • Many industry-standard body sizes and foot prints
  • Mature and highly reliable package technology
  • Effective thermal management solution
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