Thin Film

Copper/Polymide Substrates

General Information

Thin Film Application General Design Guide (PDF)

Design Rule of Single Layer Thin Film

Thin Film Metallization

Thin Film Bottom Layer

Thin Film Internal Plane

Thin Film Internal Trace

To view PDF documents, download Adobe Acrobat® Reader:

Contact Semiconductor Components Division
  

Features:

  • Finer conductor geometries for precision layout of high performance circuit designs
  • Low resistance copper trace metallization
  • Permits high density routing with excellent eletrical isolation
  • Embedded L and R elements are possible within the CuPi structure, or on top surface
  • Combining multilayer cofired alumina substrates with thin film surface patterning offers the highest performance and volume effiiciency
    		•