Side Braze/DIP Packages

Hybrid Package

General Information

HTCC Package General Design Guide (PDF)

Kovar Seal Ring

Ceramic Material Characteristics

Heat Spreader

About NTK Part Numbering for Semiconductor Packages

Side Braze/Dual In-Line Packages Open Tools List

To view PDF documents, download Adobe Acrobat® Reader:

Contact Semiconductor Components Division
  

Features:

  • Exclusive custom designed packages specific to custome requirements
  • Limitless design possibilities for integration of low to medium devices and placement of passive components
  • Motherboard, bucket style, or dual sided options are possible for higher density
  • Conventional dual in-line, single chip packages are available with a variety of lead counts and cavity size options
    		•