Side Braze/DIP Packages

Side Braze Package

General Information

HTCC Package General Design Guide (PDF)

Kovar Seal Ring

Ceramic Material Characteristics

Heat Spreader

Side Braze lead frame design

About NTK Part Numbering for Semiconductor Packages

Side Braze/Dual In-Line Packages Open Tools List

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Features:

  • Mature and highly reliable package technology
  • Limitless design possibilities for integration of low to medium devices and placement of passive components
  • Motherboard, bucket style, or dual sided options are possible for higher density
  • Conventional dual in-line, single chip packages are available from 4 to 64 leads with many cavity size options
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