Side Braze/DIP Packages

Charged Coupled Device Package (CCD)

General Information

HTCC Package General Design Guide (PDF)

Kovar Seal Ring

Heat Sink Material Properties

Ceramic Material Characteristics

Heat Spreader

About NTK Part Numbering for Semiconductor Packages

Side Braze/Dual In-Line Packages Open Tools List

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Features:

  • Mature and highly reliable package technologies used for CCD applications
  • Limitless design possibilities for integration of low to medium devicess and placement of passive components
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