Organic IC Packages

Organic Flip Chip featuring NTS Technology

General Information

NTS Design Structure

Organic Package Design Guide

NTS Design Rule Summary

About NTK Part Numbering for Semiconductor Packages

General Open Tools List

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Features:

  • Flip chip solution for high density, high performance ASIC and MPU devices
  • Multiple build up layers for signal and plane distribution are possible around the central core material
  • Low resistance copper conductors
  • Highly reliable photo/laser dielectric film is used for the build up insulator
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