Multi-chip Ceramic Module (MCM)

Motherboard Package

General Information

HTCC Package General Design Guide (PDF)

Kovar Seal Ring

Heat Sink Material Properties

Ceramic Material Characteristics

Heat Spreader

About NTK Part Numbering for Semiconductor Packages

General Open Tools List

To view PDF documents, download Adobe Acrobat® Reader:

Contact Semiconductor Components Division
  

Features:

  • Exclusive custom designed packages specific to customer requirements
  • Limitless design possibilities for integration of low to medium devices and placement of passive components
  • Motherboard, bucket style, or dual sided options are possible for higher density
  • Conventional dual in-line, single chip packages are available with a variety of lead counts and cavity size options
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