Leadless Chip Carrier (LCC)

Crystal/SAW Package

General Information

HTCC Package General Design Guide (PDF)

Ceramic Material Characteristics

About NTK Part Numbering for Semiconductor Packages

Ceramic Leadless Chip Carrier Open Tools List

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Features:

  • Ultra-miniature sizes for mobile and wireless devices
  • Standard JEDEC body sizes for conventional applications
  • High reliability ceramic materials
  • Low loss for excellent electrical performance at RF frequency
  • NTK volume manufacturing capacity
  • Wide selection of industry standard case outlines
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