Leaded Chip Carrier

J-Leaded Chip Carrier

General Information

HTCC Package General Design Guide (PDF)

Kovar Seal Ring

Heat Sink Material Properties

Ceramic Material Characteristics

Heat Spreader

J-Lead frame design

About NTK Part Numbering for Semiconductor Packages

Fine Pitch Leaded Chip Carrier Open Tools List

Flat Lead Package/Leaded Chip Carrier Open Tools List

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Features:

  • Quad or dual in-line lead configurations
  • Wide variety of JEDEC standard case outlines
  • Suitable for high reliability or space level SMT applications
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