Leaded Chip Carrier

Fine Pitch Leaded Chip Carrier

General Information

HTCC Package General Design Guide (PDF)

Kovar Seal Ring

Heat Sink Material Properties

Ceramic Material Characteristics

Heat Spreader

About NTK Part Numbering for Semiconductor Packages

Fine Pitch Leaded Chip Carrier Open Tools List

Flat Lead Package/Leaded Chip Carrier Open Tools List

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Features:

  • Quad or dual in-line lead configurations
  • Fine (up to 0.025") lead pitch formats
  • Available with ceramic non-conductive tie bar for easier handling during test
  • Wide variety of JEDEC standard case outline
  • Flat or J-bend lead forms
  • Suitable for high reliability or space level SMT applications
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