Leaded Chip Carrier

Ceramic Quad Flat Pack (CQFP)

General Information

HTCC Package General Design Guide (PDF)

Kovar Seal Ring

Heat Sink Material Properties

Ceramic Material Characteristics

Heat Spreader

Flat lead frame and braze pad design

J-Lead frame design

About NTK Part Numbering for Semiconductor Packages

Flat Lead Package/Leaded Chip Carrier Open Tools List

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Contact Semiconductor Components Division
  

Features:

  • Quad or dual in-line lead configurations
  • Gross (up to 0.050h) lead pitch format
  • Available with ceramic non-conductive tie bar for easier handling during test
  • Wide variet of JEDEC standard case outlines
  • Flat or J-bend lead forms
  • Suitable for high reliability or space level SMT applications
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