Leadless Chip Carrier (LCC)

Surface Mount Device (SMD)

General Information

HTCC Package General Design Guide (PDF)

Kovar Seal Ring

Ceramic Material Characteristics

About NTK Part Numbering for Semiconductor Packages

Ceramic Leadless Chip Carrier Open Tools List

To view PDF documents, download Adobe Acrobat® Reader:

Contact Semiconductor Components Division
  

Features:

  • Excellent reliability for surface mounting
  • Ultra-miniature size for small footprint applications
  • Low loss for excellent eletrical performance at RF frequency
  • NTK volume manufacturing capacity
  • Standard JEDEC body sizes for conventional applications
  • Wide selection of industry standard case outlines
    		•