Ceramic PGA

Surface Mountable PGA

General Information

HTCC Package General Design Guide (PDF)

Kovar Seal Ring

Ceramic Material Characteristics

About NTK Part Numbering for Semiconductor Packages

Ceramic Pin Grid Array Open Tools List

To view PDF documents, download Adobe Acrobat® Reader:

Contact Semiconductor Components Division
  

Features:

  • High-density package style for ASIC and MPU devices
  • Many industry-standard body sizes and foot prints
  • Mature and highly reliable package technology
  • Effective thermal management solution
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