Low Temperature Co-fired Ceramic (LTCC)

LTCC substrate

General Information

LTCC Flip Chip Package General Design Guide (PDF)

LTCC Material Characteristics

LTCC Embedded Capacitor

LTCC Embedded Inductor

LTCC Panel Design

LTCC Basic Design Rules

NTK NOC Material Properties

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Features:

  • Glass ceramic materials for high frequency and high speed devices
  • Flexible design rules allow for high density routing within the package structure
  • Low resistance conductors for low loss design
  • Available in panel (array) or singulated form
  • Substrates can be designed for use with flip chip mounting or with cavity structcrue for wire bonding
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