Product Guide

  • Bio-medical Ceramics
  • Cutting Tools
  • Defibrilators and Pacemakers
  • Gyrosensor
  • Semi Wafer Packaging

Thin Film Submounts

Application
Thin film material technology can be applied for high frequency and high density circuits.

Material
Base materials can be co-fired multi-layer or mon layer alumina substrates. Multiple build up layers are possible Copper Polymide (CuP) delectric applied to the surface layer.

Features
Embedded passives (Land R)) are possible within the thin film layer structure.

Applications Notes