Product Guide

  • Cutting Tools
  • Semi Wafer Packaging

Motherboard Package

Application
NTK offers a wide variety of “bath tub” packages for motherboard package applications.

Material
NTK ceramic technology addresses the need for thermal conductivity, heat durability, mechanical strength and electrical strength with TCE matching.

Features
NTK’s multilayer technology offers design flexibility for the integration of IC and passive components.

Applications Notes