Product Guide

  • Cutting Tools
  • Semi Wafer Packaging

Cavity Up PGA

Application
CPGAs are designed in ceramic multilayer package with brazed pins on cavity up and cavity down configurations. Package designs are supported in a variety of pin counts.

Material
HTCC materials are available. Please refer to the material properties of the table with respect to material properties

Features
CPGAs features include:
• Excellent electrical performance in a wide range of package sizes
• Small through hole mounting package with rugged construction
• High I/O signal carrying capacity
• Hermetically encapsulated packages offering enhanced thermal dissipation

Applications Notes

ceramic_gen_outline

Download PDF IR-8218A-OP

 

Flip Chip Area:

  • Small lines
  • Small spaces